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Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions

Published online by Cambridge University Press:  31 January 2011

Shih-kang Lin
Affiliation:
Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan, Republic of China
Kuen-da Chen
Affiliation:
Graduate Institute of Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan, Republic of China
Hao Chen
Affiliation:
Graduate Institute of Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan, Republic of China
Wei-kai Liou
Affiliation:
Department of Chemical and Materials Engineering, Lunghwa University of Science and Technology, Taoyuan County 33306, Taiwan, Republic of China
Yee-wen Yen
Affiliation:
Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan, Republic of China; and Graduate Institute of Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan, Republic of China
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Abstract

The interfacial reactions in Sn-0.7wt%Cu/ENIG SUS304 couples at 240, 255, and 270 °C are examined in this study. The Ni-containing ternary Cu6Sn5 phase is formed at the Ni/liquid interface in the early reaction stage then it detaches massively from the SUS304 substrate and splits into two layers in the molten solder as the reaction time increases. This phase finally disintegrates and disappears. The square pillar-shaped FeSn2 phase is found on top of the SUS304 substrate when the Cu6Sn5 layer detaches. The reaction phase formation, detachment, and split mechanisms are proposed. The spalling phenomenon is reviewed and discussed. The growth mechanism of the FeSn2 phase obeys the parabolic law, and the activation energy is determined to be 112.5 KJ/mol.

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Copyright
Copyright © Materials Research Society 2010

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Footnotes

a)

Present address: Department of Materials Science and Engineering, University of Wisconsin−Madison, Madison, WI 53706.

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