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X-ray Diffraction of Thin Oxide Films on Soldered Module Pins

  • T. Paul Adi (a1) and H. F. Stehmeyer (a1)

Abstract

The presence of metal oxide films from wave solder baths on timed module pins are partly responsible for non-wet problems in subsequent soldering steps. The cylindrical geometry of the pins lends itself to the characterization of thin oxide films by using the highly sensitive Debye-Scherrer camera method. As confirmed by Electron Hicroprobe Analysis (EMA), pins containing thin oxide films were used to obtain the diffraction patterns. A software program was developed that subtracts the diffraction angles of an oxids-free control pin from the pattern of the contaminated pin, and tabulates the residual d-spacing (interplanar distance) of the contaminant film.

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References

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1. Feder, R. and Berry, B.S., Seeman-Bohlin X-Ray Diffraction for Thin Films, J. Appl. Cryst. 3:372 (1970).
2. Wasserman, G. and Wiewiorosky, J., Uber ein Geiger-Zahlrohr-Goniometer nach dem Seeman-Bohlin-Prinzip, Z. Metallk. 44:567 (1963).
3. Cullity, B.D., “Elements of X-Ray Diffraction,” 2nd ed. Addison Wesley, Reading, Massachusetts (1978).
4. Joint Committee on Powder Diffraction Standards, Swarthmore, Pennsylvania (1974).

X-ray Diffraction of Thin Oxide Films on Soldered Module Pins

  • T. Paul Adi (a1) and H. F. Stehmeyer (a1)

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