Article contents
X-ray Characterisation of Residual Surface Strains after Polishing of Silicon Wafers
Published online by Cambridge University Press: 06 March 2019
Abstract
Detailed x-ray double-axis rocking-curve analysis has been made of a series of silicon wafers, polished using various colloidal silicas with a number of different conditions. Significant differences, attributable to the polishing conditions, were observed in the tails of the rocking curves, using a four-reflection, non-dispersive beam conditioner. These have been compared with theoretical simulations in order to deduce the strain profile near the surface.
- Type
- Research Article
- Information
- Copyright
- Copyright © International Centre for Diffraction Data 1989
References
- 3
- Cited by