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X-ray Characterisation of Residual Surface Strains after Polishing of Silicon Wafers

  • Linda Hart (a1), D. Keith Bowen (a1) and Graham R. Fisher (a1)

Abstract

Detailed x-ray double-axis rocking-curve analysis has been made of a series of silicon wafers, polished using various colloidal silicas with a number of different conditions. Significant differences, attributable to the polishing conditions, were observed in the tails of the rocking curves, using a four-reflection, non-dispersive beam conditioner. These have been compared with theoretical simulations in order to deduce the strain profile near the surface.

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