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On-Line Process Control Compositional Analysis of Aluminum Films Containing a Low Percentage of Copper

  • G. H. Glade (a1), J. M. Matthews (a1) and F. R. Titcomb (a1)

Abstract

Aluminum film conducting stripes are widely used for semiconductor device interconnection networks. The addition of a low percentage of copper significantly increases their life. Composition must be controlled to maintain product quality.

The paper discusses various methods used to analyze the copper composition in the aluminum films, and adaptation of one of these methods for process control application. A portable instrument designed for field use was adapted for use as an on-line instrument.

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1. Ames, I., d'Heurle, F. M. and Horstman, R. E., “Reduction of Electromigration in Aluminum Films by Copper Doping,” IBM J. Res, and Develop., July 1970, pp. 461463.
2. Liebhafsky, H. A., Pfeiffer, H. G., Winslow, E. H. and Zemany, P. D., X-Ray Absorption and Emission in Analytical Chemistry, p. 313, John Wiley and Sons (1960).

On-Line Process Control Compositional Analysis of Aluminum Films Containing a Low Percentage of Copper

  • G. H. Glade (a1), J. M. Matthews (a1) and F. R. Titcomb (a1)

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