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High Accuracy Analysis of BPSG Thin Films on Silicon Wafers by X-Ray Wafer Analyzer

Published online by Cambridge University Press:  06 March 2019

H. Kohno ,
T. Arai ,
Y. Araki  and
R. Wilson
H. Kohno
Affiliation:
Rigaku Industrial Corporation Osaka, Japan
T. Arai
Affiliation:
Rigaku Industrial Corporation Osaka, Japan
Y. Araki
Affiliation:
Rigaku/USA, Incorporated Danvers, MA, USA
R. Wilson
Affiliation:
Rigaku/USA, Incorporated Danvers, MA, USA
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Extract

The wafer analyzer has been used to fulfil many applications needs in the semiconductor industry. The prominent features of the XRF method for the semiconductor industry are:analysis of many types of films, e.g., oxides, silicides and metallic alloys, and simultaneous analysis of film thickness and compositions.

In the past, the analysis results of BPSG (Boron-doped Phospho-Silicate Glass) films, with thicknesses greater than 4000 Å, were reported. With the recent increased demand for larger scale and higher quality semiconductor devices (larger than 64 Mbit), more accurate analysis with high precision has been required.

Type
Research Article
Information
Advances in X-Ray Analysis , Volume 37: Forty-Second Annual Conference on Applications of X-ray Analysis, August 2-6, 1993 , 1993 , pp. 229 - 234
Copyright
Copyright © International Centre for Diffraction Data 1993

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